AMD. The job was sued for patent infringement. 🚨

AMD came across a full headache when Adeia, which owns technology patents, sued in the US, accusing AMD of using Hybrid Bonding technology without permission. This technology is at the heart of the 3D V-Cache system housed in the Ryzen X3D chip, making the series stand out for its gaming performance since its release in 2022.

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Adeia claimed to have tried to negotiate with AMD for years for a copyright agreement, but unsuccessfully, decided to file a lawsuit in the Western District Court of Texas, U.S.A. The case involved a total of 10 patents, divided into seven on Hybrid Bonding technology and three on advanced chip manufacturing processes, considered to be the foundation technology of the chip manufacturing industry.

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The interesting thing is that TSMC was not sued either as an AMD chip maker because Adeia saw TSMC as just a manufacturing hire, but AMD was the designer and direct beneficiary of the technology, making it the main target of the case.

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Hybrid Bonding is a technology that allows AMD to stack 3D V-Cache cache memory tightly and with higher performance on the chip. This results in AMD CPUs running faster in certain games and applications. If AMD is convicted of violating a real patent, it may have to pay back royalties, including future ongoing royalties. This will increase costs and may reflect market sales prices.

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This case is considered very important for AMD because Hybrid Bonding technology is at the core of the plans to develop future new chips like Zen 5 and Zen 6. If royalties are paid or negotiated unsuccessfully, it can affect the company's roadmap.

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Source: videocardz

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